Our 3LPT process is superior to any gold solderable coating. Gold coatings need to be very thick, anywhere from 3-10 microns, as the gold dissolves quickly in solder, whereas the 3LPT coating is usually between 0.5 and 1 micron. It is a low-temperature process (below 200º C), making it acceptable for use with more delicate parts and electronics. The exceptional yield and durability mitigate costly repairs to solder joints. 3LPT has undergone extensive stress analysis, including solder pot immersion and cryogenic testing, with little to no effect on the solderable coating and meets MILSPEC-C675C environmental standards. There is no long-term embrittlement with 3LPT as there is when using gold, and many of the parts we coated 20 years ago are still in use today. This coating is suitable for most types of glass, ceramics, and exotic substrates such as Zinc Selenide, Germanium, Zinc Sulfide, Sapphire, and Magnesium Fluoride, to name a few.