The customer wanted to continue with lead/tin solder in a non-reducing atmosphere; a coating plan consistent with the process was required. Platinum was chosen since it does not oxidize or dissolve rapidly in solder. A bonding layer of cermet, which adheres very well to most glass and ceramic materials, was used below the platinum. This coating adhered well and soldered well, but ripped out a layer of the substrate after thermal cycling. A third layer of expansion matching material was then included in the system to reduce stress in the joint.